Hymite technology reports accomplishing what others have tried but failed to do. They have been able to incorporate silicon-based packaging for high brightness LEDs. The use of silicon packaging, if effective, could bring tremendous material cost and processing savings. Hymite A/S, a Danish-German technology company and supplier of advanced packaging products for electronic components announced the introduction of a silicon-based packaging solution for high-brightness LEDs, HyLED. The company reports that a major European customer which produces digital light sources has begun using HyLED packaging for its light source. Hymite says that through the use of the HyLED technology, the company was able to achieve package miniaturization and improved efficiency.

The HyLED technology uses silicon wafers and batch micromaching/metallization processes to deliver package size reductions up to 4x. According to the company, the micromachined LED cavity acts as a reflector, thermoconductor, and reservoir for silicon. Silicon wafers perform well thermally and under stress. They may not have the performance of sapphire and gallium nitride, but they might provide a very cost effective solution for packaging. Hymite says the packaging solution would be ideal for general lighting, mobile electronics, automotive lighting, and panel backlighting.

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