Copenhagen, Denmark & Dallas, Hymite, a manufacturer of silicon-based packaging products for MEMS and electronic devices, today announced the availability of HyCap(R) S -QFN/SON, a product that offers a smaller, hermetic MEMS and IC package that is conformant with standard QFN/SON package specifications for high-volume system-in-package (SiP) applications.

The silicon encapsulation technology enables manufacturers in such markets as handheld devices to integrate MEMS with electronic components and passives into one compact package, shortening development cycles and cutting fabrication time and cost. Unlike plastic QFN/SON, which is currently the standard for non-hermetic packages, the HyCap(R) S silicon housing offers hermeticity but also smaller size and controlled internal atmosphere.

"Hymite's unique silicon-based packaging will be advantageous because it is very compatible with the silicon die," said Sandra Winkler, packaging industry analyst at Electronic Trends Publications, Inc. "The small size and the compliance with board-level standards allow this package family to be used for a number of very interesting applications."

As a silicon-based technology, HyCap(R) matches the thermal expansion coefficient of MEMS and CMOS devices. The package enables wafer-scale assembly and testing for high-volume production. High hermeticity and vacuum levels together with electrical connectivity are enabled through the use of patented micro-vias that pass from the inside of the cap to surface mount pads on the outside. Standard wafer-to-wafer sealing techniques keep the technology cost-effective.

"The customer's need for further miniaturization and integration has spurred Hymite to develop the next generation of HyCap(R) technology," said Jochen Kuhmann, Chief Technology Officer, Hymite A/S. "Our package sets new standards in size, design options and ease of assembly and testing."

HyCap(R) attaches to the device to be packaged (MEMS or IC) by metal solder, forming a hermetic seal and electrical contact. In addition to the micro-vias, a deep cavity allows for inclusion of additional discrete MEMS or ICs that can be integrated with ultra-short electrical connections using conventional die attach with wire bonding or flip-chip technology. Customers benefit from smaller packaging footprints, improved RF performance and thermal expansion matching. Direct integration of passives such as thin film resistors and capacitors allows further reduction of the overall size and bill of material. Customers can assemble with HyCap(R) using chip-to-chip, chip-to-wafer or wafer-to-wafer techniques.

HyCap(R) S QFN/SON packages are available for prototyping. Hymite is currently ramping up volume production for HyCap(R) on its 6-inch wafer line and provides assembly services in medium quantities.

About Hymite

Hymite is a technology leader of silicon-based packaging for MEMS, optical communications and other electronics industries. The products and technologies Hymite offers significantly reduce cost/performance ratio for packaging of components and systems through innovative designs, component integration and wafer-level assembly and testing. Further information can be obtained from the company's website at www.hymite.com.