June 2008 Welcome to Packaging IDeaS, Your Weekly Packaging Newsletter from Industry IDS  
Supported By: Foodservice Packaging Institute International Plastics, Inc. The Adhesive and Sealant Council Women in Packaging DVI European Plastics Converters
Exhibitors in The News
Hormel Foods Honors Multivac with Spirit of Excellence Award
Hormel Foods Honors Multivac with Spirit of Excellence Award
Multivac
Multivac supplies Hormel Foods with an array of packaging solutions and support services for a wide range of its product lines.
Qosmedix Announces New Headquarters, New VP
Qosmedix Announces New Headquarters, New VP
Qosmedix
The new 43,000 square foot building will allow for increased efficiency and enhanced workflow in order to better serve our valued customers.
Packaging Aids Corporation Seals Meals for Space Travel
Packaging Aids Corporation Seals Meals for Space Travel
PAC Machinery Group
NASA has purchased PAC`s VMS 153V, vertical vacuum packaging machine to pack food for space travel. NASA has been vacuum sealing food since the Gemini Program in the 1960s.
Mettler Toledo Provides `Pukka` Solution for Leading Leicester Pie Maker
Mettler Toledo Provides `Pukka` Solution for Leading Leicester Pie Maker
Mettler-Toledo Ltd.
METTLER TOLEDO product inspection division has provided Pukka Pies of Leicester, UK, with three high performance X-ray systems. Each is designed to provide the very highest levels of contaminant detection.
From The World of Packaging
Ossid Announces New Weigh Price Labeler Lineup
The 1500 Series offers more than 15 upgrades, including V-belt conveyors, C-Label printers, and Chaotic Mode inspection systems.
Newark Introduces Protective Peel Packaging for Integrated Circuits
Newark has launched an innovative peel packaging solution, designed to protect fragile integrated circuits during storing and handling.
Technology and Software
DALSA Extends Vision Appliance Software Capability with iNspect Color
DALSA`s Vision Appliances are easy-to-use, embedded machine vision solutions that are both powerful and quick-to-deploy for automated quality inspection applications.
Toshiba Develops Cost-Reducing MEMS Packaging
The first technology covers encapsulation under normal atmospheric condition, the second a stronger structure for vacuum sealing.
PARC to Develop Sensor Tape Technology to Track Exposure to Explosive Blasts
This technology is a flexible, wearable, electronic `tape` that contains sensors to record data associated with exposure to explosive blasts in the battlefield.
Constar Introduces Vertical Compensation Technology(VCT)
Constar’s VCT technology employs distinctive geometry to address the natural stresses placed on PET bottles and jars during the hot-fill process.
Editorial

Flexible manufacturing solutions are responding to the exclusive needs of packaging suppliers by providing a range of tracking and inspection systems.

DALSA Corporation, a global leader in machine vision technology, announced the availability of iNspect Color, a major new version of the iNspect software package for DALSA`s popular line of vision appliances.

Palo Alto Research Center Incorporated (PARC), a Xerox Corporation company, has been selected by the U.S. Defense Advanced Research Projects Agency (DARPA) to develop and prototype blast dosimeters. This technology is a flexible, wearable, electronic `tape` that contains sensors to record data associated with exposure to explosive blasts in the battlefield.

For more updates, read the next issue of Packaging IDeaS.

Editor
Industry IDS

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Featured White Paper
New Generation Non-Spill Quick Disconnect Technology
Author     :  Grant Wilhelm
Company :  Colder Products Company
Traditionally, non-spill quick disconnect couplings have served the high pressure, industrial hydraulic market. Existing commercial designs are characterized by minimal air inclusion at connection and low spillage at disconnect. Common coupler package materials include machined brass, zinc-coated steel, and stainless steel. Recent design innovations and improvements include advances in valve design, optimized flow area calculations and isolation of the valve actuation springs from the fluid flow path. These developments have led to new low pressure, thermoplastic quick disconnect couplings incorporating flush face non-spill valve technology.
Synopsis | Biography | Download Paper
New Exhibitors on IDS-Packaging
Gold Exhibitors
TCP Reliable
Silver Exhibitors
Multipond America, Inc.
Bronze Exhibitors
Cordano Packaging Engineers, LLC
Elmes Packaging Inc.
Tanaka Kapec Design Group, Inc.
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