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  Paper Details                 Browse papers by sector
Forces Driving Change in Tape and Hot Melt Adhesive Dispensing Technologies
Author            :Nordson Corporation
Designation    :Cleveland, Ohio
Company        :Nordson Corporation Packaging Group
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Synopsis

The low-maintenance trend in the 1980s produced micro processor controlled hot melt machines that automated start-up and extended the pot life of hot melts. Use of pressure-sensitive tapes doubled despite significant cost increases.

During the 1990s, the low-maintenance trend gained momentum in the hot melt sector but languished in the tape sector. Hot melt adhesives became user-friendly advanced melt adhesives while the application machinery became simpler to operate and maintain.

The chemistry of hot melt adhesives and the electronics of the application machinery will continue to evolve and result in lower costs and reduced maintenance. The PSA tapes and application machinery will also continue to evolve, adding automation generally at a higher cost.

Reprinted with Permission from Nordson Corporation Packaging Group


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