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 Contact Trilion Quality SystemsRequest more information about the product
 
 PRODUCT DESCRIPTION

Uses laser illumination and a heterodyned laser interferometry video system to measure the deformations of the lid from an applied pressure change. Can measure sub-micron deformations across the entire image by measuring the phase relationship of the pure laser light that reflects from each package’s lid, and a change in the deformation of a package lid of more than a tenth of a wavelength of light can be accurately measured. Works well as a gross leak detector, no matter how gross the leak is. 

 APPLICATION

The laser package integrity inspection system is designed to rapidly inspect the hermaticity of packages in the pharmaceutical and microelectronics (MIL-STD-883 – Optical Leak Testing) industries. Advanced capabilities include inspection of blister packages and chips on PCBs.

 

 
 Related Categories
Calibration & Testing ServicesPackaging Services
 Product Catalogs
Modular Measurement Systems


Industry IDS, Inc
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