Innovative Solution Delivers Cost-Effective, Multisite Mixed-Signal SoC and SiP Testing

Credence Systems Corporation, a provider of test solutions for the worldwide consumer semiconductor industry, announced today that its innovative MultiWave instrument for the Diamond test platform has received the Advanced Packaging Best New Product Award in the Test and Services category. MultiWave integrates the functionality of multiple instruments into one multi-channel arbitrary waveform generator and digitizer unit to provide the industry's most cost-effective mixed-signal solution for multisite testing of highly integrated system-in-package (SiP) and system-on-chip (SoC) devices.

"We are committed to offering our customers the best value in test, and the Diamond MultiWave instrument solves a full range of testing challenges for cost competitive markets. High-level integration combined with the lowest cost per channel help to address the relentless pressure to reduce the cost of test," said Lavi Lev, president and CEO of Credence. "We are delighted that Advanced Packaging has recognized the excellence of the Diamond MultiWave by presenting us with this award."

Celebrating excellence in semiconductor packaging, the Advanced Packaging Awards are presented to the finest examples of creative advancement in semiconductor technology.

"We congratulate Credence on their win of the prestigious Best New Product award in the Testing Equipment and Services category," stated Gail Flower, editor-in-chief, Advanced Packaging magazine. "Advanced Packaging is proud to continue its tradition of recognizing excellence in this segment of the industry. In recent years, innovations in advanced packaging processes, materials, and equipment have been driving the semiconductor industry forward. Now more than ever, it's important to acknowledge the achievements of these innovators."

The Diamond MultiWave provides a cost-optimized mixed-signal solution for multisite testing, incorporating four arbitrary waveform generators and four digitizers into a single compact instrument. MultiWave allows for fully parallel, concurrent testing of audio and video SiP and SoC components. This enables the significant cost of test reductions demanded by very competitive markets, while also offering maximum fault coverage with minimum test time. Additionally, the Diamond MultiWave helps customers leverage complex SiP technology, which is increasingly being used in new consumer product designs to optimize overall system cost and efficiency.

The Diamond test platform -- including the ten-slot Diamond 10 and forty-slot Diamond 40 -- delivers unprecedented performance and flexibility. An innovative, high-throughput, multi-purpose wafer sort and final test solution, the Diamond platform is specifically designed to address the economic requirements of the ultra-competitive consumer mixed-signal device markets. The Diamond is also optimized for the 200-Mbps probe market and supports massive multisite production of devices such as microcontrollers, wireless baseband ICs, display driver controllers, etc.

About Credence

Credence Systems Corporation is a global provider of automated test equipment (ATE) solutions to the high growth, consumer semiconductor industry. Credence is committed to deliver the highest standards of value -- an optimal combination of technology, turn-around time, reliability, ease of use, service and support -- to every customer, which enables important cost and performance advantages for integrated device manufacturers (IDMs), wafer foundries, outsource assembly and test (OSAT) suppliers and fabless chip companies worldwide. An ISO 9001-certified company with a presence in 20 countries, Credence is headquartered in Milpitas, California.