Singapore-based test and packaging vendor STATS ChipPac said Wednesday (Aug. 27) that it has entered into an agreement with Infineon Technologies AG to provide manufacturing services for products based on Infineon's first-generation embedded wafer-level ball grid array (eWLB) technology.

Infineon (Munich, Germany) granted licenses for eWLB technology to STATS ChipPAC, as well as STMicroelectronics NV, earlier this month.

In a statement, Wah Teng Gan, vice president of assembly and test at Infineon Asia Pacific, said the partnership with STATS ChipPAC would ensure that Infineon has the capacity to expand the number of packages manufactured with eWLB technology.