Modular measurement systems including ARAMIS for 3D image correlation and photogrammetry, 3D ESPI holography software for test bench and fine measurements, ARGUS for advanced photogrammetry sheet metal forming analysis, PONTOS dynamic 3D deformation measurement tool and laser package integrity analysis uses laser illumination and heterodyned laser interferometry video system to measure more than a tenth of a wavelength of light on deformed package lids. |