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Modular Measurement Systems

  Modular measurement systems including ARAMIS for 3D image correlation and photogrammetry, 3D ESPI holography software for test bench and fine measurements, ARGUS for advanced photogrammetry sheet metal forming analysis, PONTOS dynamic 3D deformation measurement tool and laser package integrity analysis uses laser illumination and heterodyned laser interferometry video system to measure more than a tenth of a wavelength of light on deformed package lids.

 
3D ESPI
 
 
 
 
 

Description

Holography software for test bench and fine measurements provides analyses from plots of deformation and strain distributions in color and 3-D to precise plots of stress-strain ...

Application
Used for deflection measurements, strain measurement, thermal expansion measurement, residual stress measurement and FEM verification.


 
 
ARAMIS
 
 
 
 
 

Description

3D image correlation and photogrammetry tool for 3D deformation and strain measurement of actual components under static or dynamic load in the range of 0.05% up ...

Application
Used for testing materials and materials characterization in the aerospace, automotive, microelectronics, composites manufacturing, metal forming, biomechanics and civil engineering industries.


 
 
ARGUS
 
 
 
 
 

Description
Advanced photogrammetry for sheet metal forming analysis measures the deformation of sheet metal in the stamping process by performing an automatic circle grid analysis of the entire ...


Application
Used to optimize the forming process, estimate multi stroke stamping tools, detect critical deformations or wall thinning, verify numerical simulation programs, assess characteristics of the material lots, ...


 
 
Laser Package Integrity Analysis
 
 
 
 
 

Description

Uses laser illumination and a heterodyned laser interferometry video system to measure the deformations of the lid from an applied pressure change. Can measure sub-micron deformations ...

Application

The laser package integrity inspection system is designed to rapidly inspect the hermaticity of packages in the pharmaceutical and microelectronics (MIL-STD-883 – Optical Leak Testing) industries. Advanced capabilities ...

 
 
PONTOS
 
 
 
 
 

Description

Dynamic 3D deformation measurement tool for determination of static or dynamic 3D coordinates for production deformation measurement, product development and quality control. Delivers dynamic, synchronized and ...

Application
Used for 3D measurement, verification of conceptual design studies and numerical simulations, measurement of structural vibrations, load, creep and aging tests, analysis of motion sequences, NVH measurements ...


 
 
 
 
 
 
 
 

Industry IDS, Inc
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