As part of the tutorial "Latest Development within the Component Soldering and Adhesive Technologies" Mr. Stefan Strixner M.S.Chem.Eng, Senior Process Engineer at ZESTRON Europe will be presenting "Bare Board and Assembly Surface Requirements Across the Subsequent Manufacturing Steps" at the upcoming SMT Hybrid Packaging tradeshow in Nuremberg, Germany.
This presentation will focus on a wide range of existing analytical methods assuring the highest cleanliness level from the bare board level to the final assembly product.
In a later presentation series, Helmut Schweigart Ph.D., Head of the Application Technology Department at ZESTRON Europe, will host a presentation on "Assembly Surface Analysis before Coating".
Attendees will be provided with a surface requirement in-depth perspective for reliable coating applications.
The presentations will be held during the SMT Hybrid Packaging (Nuremberg - Germany) on Tuesday, April 24th from 9:00 am to noon and Wednesday, April 25th from 1:40 pm to 2:00 pm respectively.
For additional information visit ZESTRON at Hall 7, booth 210 or visit www.zestron.com
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