Bosch Packaging Technology Food to Present Latest in Automation and Efficiency at Pack Expo2006

• Bosch Packaging Technology Food represented at Pack Expo Chicago by two major companies – Doboy Inc. and Robert Bosch Corp.Bridgman
• Enhanced automation and efficiency exhibited at booth S-712
• New systems serve wide range of food product lines from bakery to frozen food to confectionary

At Pack Expo Chicago in October, Bosch Packaging Technology division will be represented by two of its major companies - Doboy Inc. and Robert Bosch Corp. Bridgman. These companies will exhibit packaging solutions that allow food manufacturers to expand product lines, introduce greater automation to their operations, and bring more innovative products into the marketplace.

Exhibiting a wide range of new machines, Doboy will launch its Pack 201Horizontal Wrapper into the US market. This new wrapper is a safer and easy-to-maintain machine with a mid-range speed for delicate product handling. The machine is ideal for tray packaged bakery items such as biscuit stacks, crackers, chocolate candies, and frozen novelties.

Doboy will also launch a new bag sealer for pet food that secures heat seals on woven polypropylene bags as well as the new Linium 801 inverted wrapper ideal for difficult to handle products such as tortilla, licorice, or plastic cutlery. Doboy’s portfolio will also include the Stratus with SK-100 tunnel that generates world’s first new biodegradable shrink hard film, and the Delfi Feed Placer Robot for loading moving targets and into
thermoform trays.

Robert Bosch Corp. Bridgman will exhibit new machines built for bakery,frozen foods, confectionery packaging, and a wide range of other applications. The company will present two new bag makers: the SVE 3800 WR, capable of running pillow, gusseted flat bottom, quad seal, and doy packaging and the high speed SVE 2510 with a complete Bosch Rexroth control platform. These new systems will be presented together with two new compact case packers.

Bosch Packaging Technology will be participating at the Pack Expo International 2006, taking place in Chicago between October, 29th and November, 2nd. Bosch Packaging Technology will be represented at the event by its companies, Bosch Packaging Technology Pharmaceuticals,Doboy Inc., Makat, Robert Bosch Corp. Bridgman, Sigpack Systems, and Togum.

The Bosch Group is a leading global manufacturer of automotive and industrial technology,consumer goods, and building technology. In fiscal 2005, some 251,000 associates generated sales of 41.5 billion euros. Set up in Stuttgart in 1886 by Robert Bosch (1861- 1942) as “Workshop for Precision Mechanics and Electrical Engineering,” the Bosch Group today comprises a manufacturing, sales, and after-sales service network of more than 280 subsidiaries and more than 12,000 Bosch service centers in over 140 countries.

The special ownership structure of the Bosch Group guarantees its financial independence and entrepreneurial freedom. It makes it possible for the company to undertake significant up-front investments in the safeguarding of its future, as well as to do justice to its social responsibility in a manner reflective of the spirit and will of its founder. A total of 92 % of the share capital of Robert Bosch GmbH is held by the charitable foundation Robert Bosch Stiftung. The entrepreneurial ownership functions are carried out by Robert Bosch Industrietreuhand KG.

Additional information can be accessed at www.bosch.com.