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Walton Chaintech Introduces the New Packaging Design for its APOGEE Memory Modules
November 06, 2006
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Walton Chaintech introduces new packaging designs for all APOGEE memory modules beginning November 2006. APOGEE’s new packaging features a vibrant image that reflects Walton Chaintech’s commitment to building premium quality memory products and pursuing brand excellence, compatibility and reliability.

“APOGEE”, the name speaks for superiority and speed, perfectly delivers Walton Chaintech’s intention to develop ideal products in maximum function and quality. Full blown product line includes DDR 333/400 and DDR2 533/667 Non-ECC Unbuffered memory modules and all new powerful DDR2 800. All chips on the modules undergo strict sorting and are tested with the most advanced process at Walton plant, one of the top 5 memory packaging and testing service. The “All-in-House” process is implemented with the solid “wafer-in, module-out” model, giving the most quality control and production efficiency.

Also worth mentioning is that APOGEE memory modules are required to complete a high temperature burn-in test, operating in an 80°C oven and eliminating instable parts to ensure stability that is in average 20% higher than market. With such, APOGEE is able to offer Lifetime warranty for its valued customers.

APOGEE memory modules fully take advantage of the company’s strong R&D technologies and the superior packaging and testing from affiliate Walton Advanced Engineering, providing great products and service to satisfy the ever-growing customer demand.

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