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Michael J. Hodgin is currently Applications Engineering Manager with Epoxy Technology, Inc. He has authored many papers for conferences and magazines including IMAPS, SMTA, NEPCON West, Advanced Packaging, and Electronic Packaging and Production. Silver epoxies for solder replacement, MEMs, thermal management, optoelectronics, and wafer level semiconductor packaging are a few of his focused areas of research. He graduated from Hamilton College in May, 1994 with a BA in Chemistry and joined Epoxy Technology, Inc. Reprinted with Permission from www.epotek.com
Reprinted with Permission from www.epotek.com
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