A heat curing, one component epoxy, structural adhesive has high shear strength and high temperature resistance up to 205 deg C

Master Bond has developed a one component epoxy resin system, called EP11HT, for high temperature bonding applications up to 205 deg C (400 deg F).

Master Bond Polymer System EP11HT is a heat curing, structural epoxy adhesive featuring high shear strength and easy handling. It is formulated to cure at elevated temperatures, e g, 110 min at 120 deg C (250 deg F) or 75 min at 150 deg C (300 deg F).

EP11HT attains tensile shear strengths in excess of 3,300 lb/in2 and forms rigid and dimensionally stable bonds.

The service temperature range is -50 deg C to +205 deg C (-60 deg F to +400 deg F).

As a one part system, it does not require mixing prior to use and has an 'unlimited' working life at room temperature.

EP11HT bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics.

It has excellent resistance to a wide range of chemicals including acids, bases, oils, salts and many solvents.

A non-drip version called EP11HTND-2 is also available.

The cured adhesive fully meets the requirements of MIL-MMM-A-132.

It is available in pint, quart, gallon and 5 gallon containers.

-About Master Bond - Master Bond is a manufacturer of high performance adhesives, sealants, coatings, potting and encapsulation compounds and impregnation resins.

The product line offers over 3,000 grades of specially designed formulations of acrylics, anaerobics, cyanoacrylates, epoxies, latex, polyamides, polyurethanes and silicone systems to provide an optimal solution for even the most extreme applications.