Rittal has introduced a rack mountable Compact Cooling Package (CCP) which ensures electronic boards are cooled uniformly, effectively and economically.

Rittal has developed a highly efficient cooling method primarily for use with MicroTCA systems, capable of heat removal of up to 1200W. The 482.6mm (19') rack mountable Compact Cooling Package (CCP) comprises a controller managed air/water heat exchanger, 300mm deep, and a 482.6mm (19') fan tray, which can be supplied as a fully wired and piped re-cooling system. Supporting all leading IPMI and Rittal CMC-TC (Computer-Multi-Control Top-Concept) protocols, it can be controlled via a Central Processing Unit (CPU).

If a fan breaks down or in the event of extreme air temperatures (96 h at 55degC), the system still remains operational.

The use of robust controllers and sensors ensures secure cooling and allows the system to be reliably controlled automatically.

Modular and easy to install, the system can be matched to specific, actual cooling needs due to its flexibility.

Applications with ambient temperatures of up to 55degC and at 1,800 m above sea level are therefore possible.

Due to the compact designs of MicroTCA systems, power losses of 600 watts and more can be expected per shelf.

Use of Rittal's CCP enables efficient dispersal of heat, keeping the electronic systems at constant low temperatures by monitoring the internal temperature.

Up to two MicroTCA shelves can be maintained with a single system, which can easily be applied to any vertically cooled rackmount electronics.

Slide-in electronic components can be cooled by a powerful air/water heat exchanger (including a fan unit) with a cooling output of to 1,200 watts.

This innovation ensures that installed boards are cooled uniformly, effectively and economically, allowing up to 90 percent of the heat loads that arise from MicroTCA shelves and microcomputer packaging systems to be efficiently dissipated.

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