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Technology & Software  Click here to view list of papers
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This sector provides information and resources on Technology & Software through white papers, case studies, information resources and a virtual exhibition of companies dealing in products solutions and services.

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E²M/PolytronOptimizing a Manufacturing Line Using Automod with an Excel Interface
Author:Christiana l. Zhookoff
Company:E²M/Polytron


ACISS Holding BV,  NetherlandsSafe & Secure Air Cargo Containers with Integrated RFID Visibility System
Author:Henk G. Hilders
Company:ACISS Holding BV, Netherlands


Dynasys Technologies, Inc.ISO 15693 and What It Means for You
Author:Bob Scher
Company:Dynasys Technologies, Inc.


LakeWest Group, LLCRFID in Retail: The Future is Now
Author:Robert Antall
Company:LakeWest Group, LLC


Altair Engineering, Inc.Smart Product Packaging Pays Off
Author:Joanne Zuzelski And Beverly Beckert
Company:Altair Engineering, Inc.


Ben Clements and Sons, Inc.The Pressure Sensitive Label Industry
Author:Steven Clements
Company:Ben Clements and Sons, Inc.


Labthink Instruments.Co., Ltd.The Development of China's Packaging Education
Author:Labthink Instruments.Co., Ltd.
Company:Labthink Instruments.Co., Ltd.


Intralox, L.L.C.New Technology Affordably Increases Packaging Line Throughput
Author:Rachel Stolier
Company:Intralox, L.L.C.


PTCAn Introduction to Structured Product Labeling
Author:PTC
Company:PTC


Labthink Instruments.Co., Ltd.Standard of Coulometric Film Oxygen Permeability Testing
Author:Labthink Instruments.Co., Ltd.
Company:Labthink Instruments.Co., Ltd.


Hewlett PackardToward a Packaging Information Process Model
Author:Hewlett Packard
Company:Hewlett Packard


Speakers GoldProspecting Online in the Packaging Industry
Author:Cathleen Fillmore
Company:Speakers Gold


Intralox, L.L.C.Producing Rainbow and Mixed Pallets: Options and Solutions
Author:Rachel Stolier
Company:Intralox, L.L.C.


Tata Consultancy ServicesEnabling Traceability – RFID
Author:T S Rangarajan
Company:Tata Consultancy Services


UPS Professional Services Technology and System Enhancements in the UPS Distribution Environment
Author:Chad Thompson, CPP
Company:UPS Professional Services


IDTechEx LimitedThe Future is Full of Surprises--Massive Potential for Organic Electronics
Author:Dr. Peter Harrop
Company:IDTechEx Limited


Dynasys Technologies, Inc.Basic Guide To Smart Label Terminology
Author:Bob Scher
Company:Dynasys Technologies, Inc.


 Auto-ID Labs of Massachusetts Institute of TechnoPackaging and RFID: Incorporating RFID in the Real World
Author:Daniel W. Engels, Ph.D.
Company: Auto-ID Labs of Massachusetts Institute of Techno


Epoxy Technology, IncEpoxies for OptoElectronic Packaging; Applications and Material Properties
Author:Michael J. Hodgin
Company:Epoxy Technology, Inc


Tompkins AssociatesControl Systems Evolution in Pharmaceutical Packaging
Author:Ralph Cox
Company:Tompkins Associates


Labthink Instruments.Co., LtdApplication Fields for CHY-C1 Thickness Tester Become Broader
Author:Labthink Instruments.Co., Ltd
Company:Labthink Instruments.Co., Ltd


Hewlett-Packard CompanyEuropean Digital Label Printing
Author:Hewlett-Packard Company
Company:Hewlett-Packard Company


UnisysRadio Frequency Identification: Moving Beyond the Hype to Maximum Value
Author:Unisys
Company:Unisys


Packaging Technologies and InspectionPackage Testing
Author:Tony Stauffer
Company:Packaging Technologies and Inspection


Dynasys Technologies, Inc.RFID Tunnel Antennas
Author:Bob Scher
Company:Dynasys Technologies, Inc.


RedPrairieRFID Technology
Author:RedPrairie
Company:RedPrairie


Tetra PakHow Packaging can enable Growth and Innovation in the Foodservice Channel.
Author:Andrew Dun
Company:Tetra Pak


Hewlett PackardManaging Packaging as a Horizontal Process
Author:Tim Lalley
Company:Hewlett Packard


Chemical Accident Reconstruction Services, Inc.Computer Stress Analysis of Self-Pressurized Container Bottom
Author:Michael Fox, Ph.D., Pinghua Zhao, Ph.D. and Juan C
Company:Chemical Accident Reconstruction Services, Inc.


Enercon Industries Corp.Corona Treatment: A Process Overview
Author:Rory A. Wolf
Company:Enercon Industries Corp.


TransboticsInnovative Technology and User Benefits for the Packaging Industry
Author:Brian Keiger
Company:Transbotics


Kranich IndustriemesstechnikWeb-Based Networking for Industrial Marking
Author:Christian Kranich
Company:Kranich Industriemesstechnik


Creative Marketing Impact, Inc.Cosmetic Packaging Trends
Author:Deborah J. Coles-Dobay
Company:Creative Marketing Impact, Inc.


E²M PolytronTraining Methodology in the Manufacturing Packaging
Author:E²M Polytron
Company:E²M Polytron


NJM/CLI Packaging Systems InternationalRadio Frequency Identification
Author:William P.Delmolino
Company:NJM/CLI Packaging Systems International


WPO-World Packaging Organisation and STFI-PackforsFrom Push to Pull - Emerging New Structures in the Packaging Sector to Meet Future Demands
Author:Dr Carl Olsmats
Company:WPO-World Packaging Organisation and STFI-Packfors


PTCAn Introduction to Product Information Management
Author:PTC
Company:PTC


GOLD SUPPLIERS
ABB Automation Technologies AB
Alison Vincent Associates Ltd.
BASF Catalysts LLC
Dotrix N.V
Hitachi Europe GmbH
iDea B.A.R. India Pvt Ltd.
Institute Of Packaging UK
Motoman Robotec GmbH
Pack-Track
Rockwell Automation
SILVER SUPPLIERS
Dr. Lauterbach & Partner GmbH
EskoArtwork
Fanuc Robotics Europe S.A.
PDC- Europe
RÖLTGEN GmbH & Co. KG
BRONZE SUPPLIERS
Industry Bronze
Kranich Industriemesstechnik
PBI-Dansensor A/S
Sanex Packaging Connections Pvt. Ltd.

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