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FORDS Packaging Systems Strengthens Commitment to CoCreate
April 24 ,2007
CoCreate Software announced that FORDS Packaging Systems has renewed its commitment to the CoCreate OneSpace Suite, with the purchase of CoCreate...
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Multisorb Introduces Desiccant Integration Approach
April 24 ,2007
Multisorb Technologies, a global leader in cutting-edge active packaging technologies, introduces innovative drop-in and fit-in desiccant integration approaches
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Multisorb Technologies Introduces Stabilox® Canisters to Eliminate Oxygen for Enhanced Drug Product Stability
April 24 ,2007
Multisorb Technologies, a global leader in active packaging technologies, introduces its StabilOx® Canisters at Interphex 2007.
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Multisorb Introduces New Simulsorb™ Service to Provide Customized Pharmaceutical Stability Solutions Faster
April 24 ,2007
Multisorb Technologies, a global leader in cutting-edge active packaging technologies, introduces its new SimulSorb™ service to North America at Interphex 2007,...
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Multisorb Technologies Introudces New Sorbent Solutions for Enhanced Drug Product Stability and Shelf Life at Interphex 2007
April 24 ,2007
Multisorb Technologies, a global leader in cutting-edge active packaging technologies, will highlight three new sorbent solutions at INTERPHEX 2007, April 24-26...
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Multisorb Acquires Silgel Packaging
April 19 ,2007
Multisorb Technologies International has announced that it has acquired Silgel Packaging a subsidiary of AMCOL Minerals Europe
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SST Eying Up Second-Tier Taiwan Packaging and Testing Houses
April 17 ,2007
Silicon Storage Technology is interested in consolidating with Taiwan's packaging and testing houses, in order to guarantee backend production capacity. It...
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Chip Packaging Ready for Delivery
April 17 ,2007
Tessera rolls out its MicroPILR technology, claiming the interconnect could ultimately serve a broad array of chip and board applications. It...
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JDF Workflow Integration with Esko WebCenter
April 16 ,2007
Esko, the world's leading supplier of solutions for the digital imaging of flexo plates and for pre-production workflows in the packaging...
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Electronic Systems Cooled by Heat Exchanger
April 16 ,2007
Rittal has developed a rack mountable Compact Cooling Package (CCP). Its highly efficient cooling method is primarily used with MicroTCA systems,...
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Europlacer to Display Stock Management at SMT/Hybrid/Packaging 2007
April 12 ,2007

Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will showcase the...
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New Packaging Testers Think Outside the Box
March 28 ,2007
Recognizing the importance of packaging quality, Zwick has recently expanded its product range of modular and expandable materials testing systems, tools,...
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Lenovo Recognized for Environmentally Preferable PCs and Recycled/Recyclable Packaging Design
March 22 ,2007
Lenovo today was recognized by the Chairman of the White House Council on Environmental Quality
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CAPE Systems to Exhibit at Packaging Expo
March 21 ,2007
CAPE Systems was selected by Sam's and Wal- Mart to exhibit at this expo to show their merchants and manufacturers how...
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Int'l Conference Invites Papers on Semiconductor Packaging & Test
March 07 ,2007
The International Wafer-Level Packaging Conference has issued a "Call for Papers" for its fourth annual program, scheduled for September 17-19 at...
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Matrix LED Packaging Technologies Explained
March 01 ,2007
Paper will feature a brief overview of market applications and package options, using a case study to highlight challenges encountered and...
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Nanotechnology Project Aims to Reduce Packaging Waste
February 27 ,2007
French food and beverage company Danone is working with Queen's University in Northern Ireland to develop new polymer nanocomposites that enable...
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The Future of Packaging Software in Linux
February 23 ,2007
There are currently at least five popular ways of installing software in GNU/Linux.
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Honeywell Expands Semiconductor Packaging Research
February 16 ,2007
As part of the expansion, Honeywell will invest more than $1 million in facility and equipment. The expansion will also include...
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New Packaging from HP to cause Big Drop in Emissions
February 14 ,2007
HP has announced that its redesigned print cartridge packaging for North America will reduce greenhouse gas emissions by an estimated 37...
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