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After Its Fulgurating Success with the Drupa, Eskoartwork Exposes to Viscom Europe 2008
July 04 ,2008
Viscom Europe, the living room communication specialist visual which will be held of the 24 at September 26, 2008 in Paris...
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Graphic Packaging to Temporarily Cease Production at LA Mill
June 30 ,2008
In response to sharp cost increases for fiber, energy and chemicals, Graphic Packaging Intl. plans to temporarily shut down its No....
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Graphic Packaging Plans Price Increase
June 26 ,2008
Graphic Packaging Holding Co. will increase prices on unbleached paperboard used in food packaging, in a move to pass higher energy...
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Dr. Lauterbach & Partner (LP.) at the Drupa 2008
June 25 ,2008
LP. showcased the latest release of his SAP ERP based business solution for the print and packaging industry at Drupa 2008.
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Checkpoint Systems, Inc. to Acquire OATSystems
June 24 ,2008
Checkpoint Systems, Inc.,a leading manufacturer and marketer of identification, tracking, security and merchandising solutions for the retail industry and its supply...
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Plextronics Offers its Solar Cell Inks in Research Quantities
June 19 ,2008
Company Launches Research-Grade Ink System at Conference in Denver.
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Backlit Needle Calibration Station
June 19 ,2008
Backlit calibration creates better definition for more accurate vision alignment.
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AuthenTec TouchStone Packaging Technology Enables Watertight Cell Phone
June 17 ,2008
AuthenTec announced that its TouchStone fingerprint sensor packaging technology will enable future generations of waterproof cell phones, including a new phone...
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Software for the Management of Plantations and Packaging Houses for Bananas
June 17 ,2008
Good practices are considered a standard for every producer both in know-how and technologies (including skills). A predefined basis of information...
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YTV M1m AOI
June 16 ,2008
YESTech’s advanced Thin Camera™ technology offers high-speed device inspection with exceptional defect coverage.
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FlipChip Partners with Unisem in Wafer Bumping, Wafer Level Packaging
June 16 ,2008
Unisem (M) Berhad (Unisem) and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) have entered into an agreement with FlipChip International, LLC...
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P3 Software is Proud to Announce another Major Upgrade for the P3Expeditor System
June 13 ,2008
Update now by using the ``Global/Update Application`` function on the main screen of P3Expeditor.
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DirEKt Coat
June 13 ,2008
DEK`s DirEKt Coat™ is a unique system that uses a mass imaging platform to enable the coating of wafers with die...
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Microbonddocfish™ - Ultrafine Pitch Solder Paste, Microspheres and Tacky Fluxes for Bumping Applications
June 13 ,2008
The Umicore Business Unit ``Electronic Materials`` with its Product line ``Microbond - EPM`` introduces MicrobondDocfish, a product family of Wafer- and...
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ATE Industry Maneuvers Around `Perfect Storm` of Issues at 90 nm and Below
June 12 ,2008
Discrete challenges are combining and churning to create a ``perfect storm`` for ATE vendors to maneuver around, while they also take...
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Multi-Die Packages Versus Multiple Single Die Power LEDs
June 12 ,2008
Multi-die packages are currently the `flavour of the month` amongst the high power led manufacturers.
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Easylabelr 5 Terminal Server Labeling Software
June 11 ,2008
Tharo Systems, Inc. presents the Terminal Server version of their EASYLABEL® 5 software for product identification, bar code and RFID labeling.
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DALSA Extends Vision Appliance Software Capability with iNspect Color
June 04 ,2008
DALSA`s Vision Appliances are easy-to-use, embedded machine vision solutions that are both powerful and quick-to-deploy for automated quality inspection applications.
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Toshiba Develops Cost-Reducing MEMS Packaging
June 04 ,2008
The first technology covers encapsulation under normal atmospheric condition, the second a stronger structure for vacuum sealing.
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PARC to Develop Sensor Tape Technology to Track Exposure to Explosive Blasts
June 04 ,2008
This technology is a flexible, wearable, electronic `tape` that contains sensors to record data associated with exposure to explosive blasts in...
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