DEK’s DirEKt Coat™ is a unique system that uses a mass imaging platform to enable the coating of wafers with die attach materials down to 25 microns in thickness. Enabled by a DEK-engineered ultra flat pallet, a wafer shield for active side wafer protection, a Galaxy mass imaging system and a specially designed squeegee, DirEKt Coat delivers a solution for all ultra-thin wafer-level coating processes including die attach materials, epoxy and protective backside coatings.

DEK International

Semicon Booth # 8111