| Global Developments |
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NXP and ASE to Form JV for IC Testing
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NXP Semiconductors, formerly Philips Semiconductors, and Advanced Semiconductor Engineering have announced the signing of a MoU to form a joint venture to focus on semiconductor testing and packaging.
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PFM Packaging Machinery at Pro2Pac
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PFM Packaging Machinery will be showcasing three of its most exciting and versatile machines at the Pro2Pac show which coincides with the IFE. These will comprise Pearl Flowrapper, the Azimuth Vertical Bagger, and MBP10 Multihead Weigher.
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| Editorial |
HP has announced that it has redesigned print cartridge packaging for North America that will reduce green house gas emissions by an estimated 37 million pounds in 2007 – the equivalent of taking 3,600 cars off the road for one year.
According to Pradeep Jotwani, senior vice president, HP “Developing environmentally responsible packaging is not only valued by HP, our customers and our partners – it’s also good business.”
By this, the company expects to eliminate the use of nearly 15 million pounds of materials including 3 million pounds of corrugated cardboard in 2007. The benefits of doing so are enormous. Overall, this is expected to reduce truck traffic in the United States and Canada by estimated 1.5million miles in 2007.
Read up on more packaging information in the next issue of Packaging IDeaS.
Editor
Industry IDS
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To exhibit on IDS-Packaging
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david.steele@industryids.com Tel: +1-866-350-1938
Fax: +1-312-893-2114 |
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